Original contributions are solicited on topics that include but are not limited to:

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• Modeling and simulation of established semiconductor devices, including
  FinFETs, GAA FETs, ultra-thin SOI devices, optoelectronic devices, TFTs,
  sensors, power electronic devices, and organic electronic devices

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• Modeling and simulation of emerging devices including tunnel FETs, SETs,
  spintronic devices, straintronic devices, bio-electronic devices, quantum
  computing devices, and new material-based devices for various applications

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• Modeling and simulation of all sorts of semiconductor processes, including first
  principles material design, and growth simulation of nano-scale fabrication

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• Advances in fundamental aspects of device modeling and simulation, including
  of charge, spin, and thermal transport, of collective states including
  spin/magnetic and charge, and of fluctuation, noise, and reliability.

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• Numerical methods and algorithms, including grid generation, user-interface,
  and visualization

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• Compact modeling for circuit simulation, including low-power, high frequency,
  and power electronics applications

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• Process/device/circuit co-simulation in context with system design and
  verification, including for emerging devices

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• Modeling and simulation of equipment, topography, lithography

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• Thermal/mechanical simulation & characterization at component, board, and
  system levels for all packaging technologies

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• Modeling and simulation of interconnects for chiplets, heterogenous integration,
  hybrid bonding, 2.5D/3D & other advanced packaging schemes

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